The CPU and chipset are designed on rear of the motherboard.

Heat can be directly spreaded to the out space with such motherboards

While implementing RTX motherboard in our computer system, it is well found that this simple change will bring amazing positive effect.

There is a Big duct......

The huge heatsink have been built with this steel plate as part of the case.

The chipset(MCH, ICH)have been moved on to another side of motherboard together with CPU socket. The huge heatsink are far enough for them.....

ATX or BTX only brings two-dimensional changes of the layout, and the design of RTX has extended into three-dimensional changes,

The shift from two-dimension to three-dimension has left wider space for same chassis.

The major heat source has been transferred from the internal to the external.

Another new space emerges after removing CPU and chipset.

.Heat density inside this space is greatly eased and temperature budgets is well shrunk.

Capacitors no longer suffer from the heat generated by CPU

Graphics card become a boss.

From bottom to top.

RTX better conforms the law of nature.....

All "hot sports" are in proper place via system airflow.

Proof-of concept systems that demonstrate successful implementation of RTX..

Thermal design for high reliability and almost quiet of the computing system can no longer be treated in isolation.

While breaking the traditional thinking set, a new age with rich achievements is coming.

The current trend in computing technology results in an increase in both the raw power as well as the power density(NO).

The drive to manage safe and reliability is resulting in the need for lower operating temperatures(YES).

The desired outcome would be to drive design and technology development concurrently at motherboard and system-level packaging to ensure that RTX　thermal solutions can support the demand for increasing computing and communication needs.